Method and apparatus for thin metal film thickness measurement
US7204639B1 · kind B1 · utility
7Cited by
16References
10Claims
0Family size
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Key dates
| Filing date | Sep 26, 2003 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Sep 26, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B21/085
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measuring a metal film thickness is provided. The method initiates with heating a region of interest of a metal film with a defined amount of heat energy. Then, a temperature of the metal film is measured. Next, a thickness of the metal film is calculated based upon the temperature and the defined amount of heat energy. A chemical mechanical planarization system capable of detecting a thin metal film through the detection of heat transfer dynamics is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.