Method for in-situ uniformity optimization in a rapid thermal processing system
US7205231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Jun 18, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a method for thermally processing a substrate in a thermal processing system. The method provides an amount of heat to the substrate and obtains information associated with the substrate when the amount of heat is provided. For example, the substrate is provided at a presoak position within the thermal processing system, wherein the presoak position, and one or more properties associated with the substrate, such as a position and temperature, are measured. An optimal process parameter value to provide an optimal thermal uniformity of the substrate is then determined, based, at least in part, on the information obtained from the substrate. For example, a soak position of the substrate is determined, wherein the determination is based, at least in part, on the one or more measured properties associated with the substrate, and a thermal uniformity associated with a reference data set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.