Electronic assembly including multiple substrates
US7205652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2005 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Mar 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon. A first electronic component is electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate. At least one of a plurality of conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.