Sealed polishing pad, system and methods
US7210980B2 · kind B2 · utility
11Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2005 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Aug 26, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.