Inventor · La Honda, CA, US

Dominic J. Benvegnu

119Patents
13h-index
63Co-inventors
89Inventor score

Filing activity: Jun 18, 1997 → Nov 2, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US5900130A Method for sample injection in microchannel device Emerging Cross-Sectional Technologies 330 Expired
US7409260B2 Substrate thickness measuring during polishing Electricity 43 Active
US7764377B2 Spectrum based endpointing for chemical mechanical polishing Electricity 37 Expired
US7513818B2 Polishing endpoint detection system and method using friction sensor Physics 32 Expired
US7406394B2 Spectra based endpointing for chemical mechanical polishing Electricity 29 Expired
US7112119B1 Sealed polishing pad methods Performing Operations; Transporting 22 Expired
US7195535B1 Metrology for chemical mechanical polishing Performing Operations; Transporting 18 Expired
US8562389B2 Thin polishing pad with window and molding process Performing Operations; Transporting 18 Active
US8088298B2 Spectra based endpointing for chemical mechanical polishing Electricity 18 Active
US7264536B2 Polishing pad with window Performing Operations; Transporting 17 Expired
US7226339B2 Spectrum based endpointing for chemical mechanical polishing Electricity 16 Expired
US8292693B2 Using optical metrology for wafer to wafer feed back process control Electricity 14 Active
US7774086B2 Substrate thickness measuring during polishing Electricity 14 Active
US8352061B2 Semi-quantitative thickness determination Electricity 13 Active
US9308618B2 Linear prediction for filtering of data during in-situ monitoring of polishing Performing Operations; Transporting 13 Active
US9138858B2 Thin polishing pad with window and molding process Performing Operations; Transporting 12 Active
US7998358B2 Peak-based endpointing for chemical mechanical polishing Electricity 12 Active
US7210980B2 Sealed polishing pad, system and methods Performing Operations; Transporting 11 Expired
US8039397B2 Using optical metrology for within wafer feed forward process control Electricity 11 Active
US9490186B2 Limiting adjustment of polishing rates during substrate polishing Electricity 11 Active
US8475228B2 Polishing pad with partially recessed window Performing Operations; Transporting 11 Active
US7727049B2 Friction sensor for polishing system Emerging Cross-Sectional Technologies 10 Active
US7306507B2 Polishing pad assembly with glass or crystalline window Electricity 10 Expired
US7942724B2 Polishing pad with window having multiple portions Performing Operations; Transporting 9 Active
US7840375B2 Methods and apparatus for generating a library of spectra Electricity 9 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.