Method and apparatus for providing distributed fluid flows in a thermal management arrangement
US7212405B2 · kind B2 · utility
14Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2004 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | Apr 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention include an apparatus, method, and system for providing a flow distributive interface for a thermal management arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.