Integrated cooling system for electronic devices
US7215547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Jul 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.