Method of a coating heat spreader
US7219421B2 · kind B2 · utility
5Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2004 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Mar 11, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.