Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

US7221048B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Frank Daeche · Unterhaching, DE
• Jochen Dangelmaier · Beratzhausen, DE
• Stefan Paulus · Zeitlarn, DE
• Bernd Stadler · Donaustauf, DE
• Horst Theuss · Wenzenbach, DE
• Michael Weber · Mainburg, DE

Key dates

• Filing date: Feb 1, 2005
• Grant date: May 22, 2007
• Expiry date: Feb 1, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F77/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.