Package structure
US7224061B2 · kind B2 · utility
8Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Dec 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.