Wen-Bin Sun
6Patents
4h-index
17Co-inventors
50Inventor score
Filing activity: Aug 16, 2004 → Nov 25, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7279782B2 | FBGA and COB package structure for image sensor | Electricity | 13 | Expired |
| US7224061B2 | Package structure | Electricity | 8 | Expired |
| US7400037B2 | Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP | Electricity | 4 | Expired |
| US7525139B2 | Image sensor with a protection layer | Electricity | 4 | Active |
| US7476565B2 | Method for forming filling paste structure of WL package | Electricity | 2 | Active |
| US9405323B2 | Wearable electronic device | Physics | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.