Resilient contact structures formed and then attached to a substrate
US7225538B2 · kind B2 · utility
169Cited by
80References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2001 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Jan 11, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical connections on a substrate to form a contact assembly. The electrical connections on the substrate may be metallic pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.