Substrate edge grip apparatus
US7226269B2 · kind B2 · utility
7Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2004 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Feb 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the invention is a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effector. The jaws are adapted to be actuated by a feature remote from the robot end effector to release the substrate for delivery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.