Spectrum based endpointing for chemical mechanical polishing
US7226339B2 · kind B2 · utility
16Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2005 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Aug 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum source configured to provide a vacuum, a vacuum nozzle, and a vacuum line that connects the vacuum source to the vacuum nozzle. The source of gas and the delivery nozzle are configured to direct a flow of gas across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.