Semiconductor device with wire bond inductor and method
US7227240B2 · kind B2 · utility
33Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2002 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Sep 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L150) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.