Methods and apparatus for determining scrubber brush pressure
US7229504B2 · kind B2 · utility
13Cited by
17References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2005 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Dec 15, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B1/34
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In a scrubber adapted to clean a semiconductor wafer, the torque of a brush rotation motor is monitored while a scrubber brush is in contact with the wafer and is being rotated by the motor. The position of the brush relative to the wafer may be adjusted based on the monitored torque to regulate the pressure applied to the wafer by the brush. Open loop positioning or closed loop control may be employed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.