Patent · US Expired

Semiconductor component and sensor component for data transmission devices

US7230309B2 · kind B2 · utility

13Cited by

6References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Thomas Engling · Oberkochen, DE
Alfred Haimerl · Sinzing, DE
Joachim Mahler · Regensburg, DE
Wolfgang Schober · Amberg, DE

Key dates

Filing date	Oct 4, 2004
Grant date	Jun 12, 2007
Priority date	—
Expiry date	Apr 25, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.