Electroplating bath containing wetting agent for defect reduction
US7232513B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2004 |
| Grant date | Jun 19, 2007 |
| Priority date | — |
| Expiry date | Feb 18, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/627
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating solution. In some embodiments, the wetting agent decreases the air-liquid surface tension of the electroplating solution to 60 dyne/cm2 or less to increase the wetting ability of the solution with a substrate surface. In some embodiments of a method for plating metal onto substrate surface, the electroplating solution has a measured contact angle with the substrate surface less than 60 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.