Inventor · West Linn, OR, US

Eric G. Webb

23Patents
12h-index
32Co-inventors
77Inventor score

Filing activity: Nov 27, 2001 → Jun 4, 2015

Most-cited inventions

PatentTitleAreaCited byStatus
US6664122B1 Electroless copper deposition method for preparing copper seed layers Emerging Cross-Sectional Technologies 41 Expired
US8158532B2 Topography reduction and control by selective accelerator removal Electricity 30 Active
US7232513B1 Electroplating bath containing wetting agent for defect reduction Chemistry; Metallurgy 27 Expired
US7605082B1 Capping before barrier-removal IC fabrication method Emerging Cross-Sectional Technologies 23 Expired
US7879218B1 Deposit morphology of electroplated copper Electricity 19 Active
US8043958B1 Capping before barrier-removal IC fabrication method Emerging Cross-Sectional Technologies 19 Active
US7442267B1 Anneal of ruthenium seed layer to improve copper plating Electricity 15 Expired
US7972970B2 Fabrication of semiconductor interconnect structure Electricity 15 Active
US7897198B1 Electroless layer plating process and apparatus Electricity 14 Active
US7690324B1 Small-volume electroless plating cell Electricity 13 Active
US7811925B1 Capping before barrier-removal IC fabrication method Emerging Cross-Sectional Technologies 13 Active
US8372757B2 Wet etching methods for copper removal and planarization in semiconductor processing Electricity 12 Active
US8470191B2 Topography reduction and control by selective accelerator removal Electricity 11 Active
US6884335B2 Electroplating using DC current interruption and variable rotation rate Emerging Cross-Sectional Technologies 10 Expired
US8197662B1 Deposit morphology of electroplated copper Electricity 10 Active
US8415261B1 Capping before barrier-removal IC fabrication method Emerging Cross-Sectional Technologies 9 Active
US7341946B2 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Electricity 9 Expired
US7947163B2 Photoresist-free metal deposition Electricity 8 Active
US9074286B2 Wet etching methods for copper removal and planarization in semiconductor processing Electricity 8 Active
US8481432B2 Fabrication of semiconductor interconnect structure Electricity 4 Active
US9447505B2 Wet etching methods for copper removal and planarization in semiconductor processing Electricity 4 Active
US8257781B1 Electroless plating-liquid system Electricity 3 Active
US8500985B2 Photoresist-free metal deposition Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.