Patterning method
US7235464B2 · kind B2 · utility
12Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2003 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Apr 17, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.