Redistributed solder pads using etched lead frame
US7235877B2 · kind B2 · utility
3Cited by
0References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 21, 2005 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Sep 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package has a thinned semiconductor die fixed in a shallow opening in a conductive body. The die electrodes at the bottom of the die are plated with a redistributed contact which overlaps the die bottom contact and an insulation body which fills the annular gap between the die and opening. A process is described for the manufacture of the package in which plural spaced openings in a lead frame body and are simultaneously processed and singulated at the end of the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.