Patent · US Expired

Photo-assisted method for semiconductor fabrication

US7238616B2 · kind B2 · utility

449Cited by
24References
30Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 28, 2005
Grant dateJul 3, 2007
Priority date
Expiry dateMar 28, 2025

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76864
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention provides a processing system comprising a remote plasma activation region for formation of active gas species, a transparent transfer tube coupled between the remote activation region and a semiconductor processing chamber, and a source of photo-energy for maintaining activation of the active species or providing photo-energy for a non-plasma species during transfer through the transparent tube to the processing chamber. The source of photo-energy preferably includes an array of UV lamps. Additional UV lamps may also be used to further sustain active species and assist processes by providing additional in-situ energy through a transparent window of the processing chamber. The system can be utilized for processes such as layer-by-layer annealing and deposition and also removal of contaminants from deposited layers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.