Cylinder for thermal processing chamber
US7241345B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2003 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Jul 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The cylinder includes a core and a coating covering most of the core. The core is made from a heat-resistant or insulating material. The core has inner and outer side walls and opposing first and second ends. The outer side wall is further away from a central longitudinal axis of the cylinder than the inner wall. The first end is configured to contact an edge ring that supports a semiconductor substrate. The coating is substantially opaque to infrared radiation, and covers all external surfaces of the core except for the first end. The core is preferably made from quartz or ceramics, while the coating is preferably made from a polysilicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.