Sundar Ramamurthy
28Patents
10h-index
61Co-inventors
74Inventor score
Filing activity: Jul 6, 2000 → Apr 26, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7509035B2 | Lamp array for thermal processing exhibiting improved radial uniformity | Electricity | 22 | Expired |
| US7127367B2 | Tailored temperature uniformity | Electricity | 22 | Expired |
| US6888104B1 | Thermally matched support ring for substrate processing chamber | Electricity | 18 | Expired |
| US6897131B2 | Advances in spike anneal processes for ultra shallow junctions | Electricity | 18 | Expired |
| US7972441B2 | Thermal oxidation of silicon using ozone | Electricity | 15 | Expired |
| US6803546B1 | Thermally processing a substrate | Electricity | 12 | Expired |
| US8056500B2 | Thermal reactor with improved gas flow distribution | Electricity | 12 | Active |
| US7241345B2 | Cylinder for thermal processing chamber | Electricity | 12 | Expired |
| US7041931B2 | Stepped reflector plate | Electricity | 11 | Expired |
| US8536492B2 | Processing multilayer semiconductors with multiple heat sources | Electricity | 10 | Active |
| US7414224B2 | Backside rapid thermal processing of patterned wafers | Mechanical Engineering; Lighting; Heating | 9 | Active |
| US8608853B2 | Thermal reactor with improved gas flow distribution | Electricity | 7 | Active |
| US8409353B2 | Water cooled gas injector | Electricity | 6 | Active |
| US8888916B2 | Thermal reactor with improved gas flow distribution | Electricity | 4 | Active |
| US8658945B2 | Backside rapid thermal processing of patterned wafers | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US7811877B2 | Method of controlling metal silicide formation | Electricity | 3 | Active |
| US9431278B2 | Backside rapid thermal processing of patterned wafers | Mechanical Engineering; Lighting; Heating | 2 | Active |
| US8314369B2 | Managing thermal budget in annealing of substrates | Electricity | 2 | Active |
| US7700376B2 | Edge temperature compensation in thermal processing particularly useful for SOI wafers | Electricity | 2 | Active |
| US9114479B2 | Managing thermal budget in annealing of substrates | Electricity | 1 | Active |
| US7986871B2 | Processing multilayer semiconductors with multiple heat sources | Electricity | 1 | Active |
| US9947578B2 | Methods for forming low-resistance contacts through integrated process flow systems | Electricity | 1 | Active |
| US10354882B2 | Low thermal budget crystallization of amorphous metal silicides | Electricity | 0 | Active |
| US7923660B2 | Pulsed laser anneal system architecture | Electricity | 0 | Active |
| US9595459B2 | Managing thermal budget in annealing of substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.