Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
US7241636B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2005 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Nov 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method provides an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric. A first metal layer having a plurality of openings overlies the substrate. A first electrically insulating layer overlies the first metal layer. A second metal layer overlies the first electrically insulating layer, the second metal layer having a plurality of openings. An interconnect pad that defines an interconnect pad area overlies the second metal layer. At least a certain amount of the openings in the two metal layers are aligned to improve structural strength of the interconnect structure. The amount of alignment may differ depending upon the application and materials used. A bond wire connection or conductive bump may be used with the interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.