Inventor · Austin, TX, US

Kevin J. Hess

39Patents
10h-index
37Co-inventors
75Inventor score

Filing activity: Nov 26, 2002 → Dec 5, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7355289B2 Packaged integrated circuit with enhanced thermal dissipation Electricity 54 Active
US7632715B2 Method of packaging semiconductor devices Electricity 41 Active
US7129566B2 Scribe street structure for backend interconnect semiconductor wafer integration Electricity 39 Expired
US9446858B2 Apparatus and methods for tethered aerial platform and system Performing Operations; Transporting 23 Active
US6933614B2 Integrated circuit die having a copper contact and method therefor Electricity 18 Expired
US7572680B2 Packaged integrated circuit with enhanced thermal dissipation Electricity 17 Active
US7374971B2 Semiconductor die edge reconditioning Electricity 17 Expired
US6921979B2 Semiconductor device having a bond pad and method therefor Electricity 15 Expired
US7276435B1 Die level metal density gradient for improved flip chip package reliability Electricity 13 Active
US9076664B2 Stacked semiconductor die with continuous conductive vias Electricity 10 Active
US7626276B2 Method and apparatus for providing structural support for interconnect pad while allowing signal conductance Electricity 9 Active
US7829997B2 Interconnect for chip level power distribution Electricity 9 Active
US7247552B2 Integrated circuit having structural support for a flip-chip interconnect pad and method therefor Electricity 8 Expired
US7821104B2 Package device having crack arrest feature and method of forming Electricity 7 Active
US8349666B1 Fused buss for plating features on a semiconductor die Electricity 7 Active
US7750465B2 Packaged integrated circuit Electricity 5 Active
US7550318B2 Interconnect for improved die to substrate electrical coupling Electricity 5 Active
US8129226B2 Power lead-on-chip ball grid array package Electricity 4 Active
US8501539B2 Semiconductor device package Electricity 4 Active
US8105933B2 Localized alloying for improved bond reliability Electricity 4 Active
US7241636B2 Method and apparatus for providing structural support for interconnect pad while allowing signal conductance Electricity 3 Expired
US8680674B2 Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices Electricity 3 Active
US7857137B2 Wound care kit Human Necessities 3 Active
US8368172B1 Fused buss for plating features on a semiconductor die Electricity 2 Active
US8791582B2 Integrated circuit package with voltage distributor Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.