Integrated circuit die with pedestal
US7242101B2 · kind B2 · utility
13Cited by
15References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2004 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Aug 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.