Methods for planarization of Group VIII metal-containing surfaces using complexing agents
US7244678B2 · kind B2 · utility
2Cited by
60References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2005 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Mar 16, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A planarization method includes providing a second and/or third row Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a polishing surface in the presence of a planarization composition that includes a complexing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.