Methods of making microelectronic packages including folded substrates
US7246431B2 · kind B2 · utility
86Cited by
24References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2003 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Aug 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion pivots with respect to a first portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.