Wire clamping plate
US7246735B2 · kind B2 · utility
5Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2005 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Feb 7, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate comprises doped silicon carbide, which makes it electrically conductive and exhibit a high level of wear resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.