Method for making a semiconductor multi-package module having inverted bump chip carrier second package
US7247519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2006 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Jan 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the upper and lower substrates are interconnected by wire bonding, and in which the inverted second package comprises a bump chip carrier package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper bump chip carrier package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.