Method for adjusting a substrate in an appliance for carrying out exposure
US7248365B2 · kind B2 · utility
1Cited by
7References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2003 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Jul 14, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03B27/32
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The unevennesses of a chuck are measured at various positions and are stored, as discrepancies from an idealized plane, in a databank. The measured discrepancies are used to calculate corrections for the predetermined settings for the focus distance and/or the tilt of the chuck. These corrections are in each case used differently for adjusting the respective exposure of the exposure areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.