Method for manufacturing an image sensor
US7250324B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2003 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Jun 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/54
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer on the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip, which is formed with a plurality of bonding pads, to the upper surface of the substrate, the photosensitive chip being located within the cavity; providing a plurality of wires to electrically connect the bonding pads of the photosensitive chip to the substrate; supplying an adhesive medium to the cavity; placing a transparent layer on the frame layer to cover the photosensitive chip so as to form the image sensor; and rotating the image sensor to make the adhesive medium be uniformly distributed over the upper surface of the substrate so that particles within the cavity are adhered to the adhesive medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.