Multi-package module with heat spreader
US7250676B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2005 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Aug 3, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-package module (MPM) with a heat spreader is disclosed, which comprises a substrate, a chip, a plurality of chip scale packages (CSP), and a heat spreader. The CSPs are disposed on the peripheral region of the substrate, and the chip is disposed on the central region of the substrate among the CSPs. Each CSP has a surface higher than the back surface of the chip to support the heat spreader. The heat spreader has an attachment surface including an extrusion region at the center and a planar region at the periphery. The planar region of the heat spreader is attached to the surfaces of the CSPs, and the extrusion region is thermally coupled to the back surface of the chip to save consumption of thermal interface material (TIM) and a dummy die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.