Circular wire-bond pad, package made therewith, and method of assembling same
US7250684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Dec 15, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.