Circuit arrangement having a number of integrated circuit components on a carrier substrate and method for testing a circuit arrangement of this type
US7251772B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2003 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Jun 30, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/5006
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A circuit arrangement can have a number of integrated circuit components, which are arranged on a carrier substrate. A reception circuit for receiving a control signal can be coupled to one of the connection pads on the input side and can be connected to each of the circuit components on the output side. A bridging circuit controlled by a test mode signal can electrically bridge the reception circuit. In a testing method, a plurality of connection pads can be connected to a first potential and at least one of the connection pads can be connected to a second potential. The bridging circuit can be activated and the current measured, by a test arrangement, at the at least one of the connection pads. Inspection for leakage currents in connections between input-side reception circuits and the circuit components can be measured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.