Abrasive composition for the integrated circuit electronics industry
US7252695B2 · kind B2 · utility
0Cited by
12References
14Claims
0Family size
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Key dates
| Filing date | Nov 8, 2006 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Nov 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Abrasive composition for the integrated circuits electronics industry comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds and an abrasive surfactant, this abrasive being for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated by such a composition, and a process for mechanical chemical polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.