Pascal Letourneau
5Patents
2h-index
2Co-inventors
33Inventor score
Filing activity: Aug 2, 1999 → Nov 8, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6302765A | Process for mechanical chemical polishing of a layer in a copper-based material | Electricity | 5 | Expired |
| US6386950B1 | Process for mechanical chemical polishing of layer of aluminium or aluminium alloy conducting material | Chemistry; Metallurgy | 4 | Expired |
| US7144814B2 | Abrasive composition for the integrated circuits electronics industry | Electricity | 2 | Expired |
| US6362108B1 | Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant | Chemistry; Metallurgy | 1 | Expired |
| US7252695B2 | Abrasive composition for the integrated circuit electronics industry | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.