Ball grid array housing having a cooling foil
US7256493B2 · kind B2 · utility
4Cited by
7References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 2, 2005 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Oct 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one semiconductor chip. For better heat dissipation from the housing, the ball grid includes a metallic cooling foil, or a metallic cooling plate. A method of making a ball grid array is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.