Test sockets, test systems, and methods for testing microfeature devices
US7256595B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2004 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | May 12, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.