Polishing apparatus
US7258595B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2003 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Apr 27, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus comprises a polishing table having a polishing surface and a top ring for holding a substrate to be polished, in which the substrate when held by the top ring is pressed against the polishing surface of the polishing table and thus polished. A capacitance type sensor and/or an eddy-current type sensor is disposed at one or more location(s) in the vicinity of the top ring. The capacitance type sensor detects escaping of the substrate to be polished based on a change in capacitance between the capacitance type sensor and a top surface of the polishing table. The eddy-current type sensor detects escaping of the substrate to be polished based on a change in electrical resistance between the eddy-current type sensor and the top surface of the polishing table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.