Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test

US7259580B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Paul J. Aube · Vergennes, US
• Normand Cote · Bedford, US
• Roger Gamache · South Burlington, US
• David L. Gardell · Saint Albans, US
• Paul M. Gaschke · Beacon, US
• Marc D. Knox · Mechanicsville, US
• Denis Turcotte · Granby, CA

Key dates

• Filing date: Feb 22, 2005
• Grant date: Aug 21, 2007
• Expiry date: Feb 24, 2025

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2868
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.