Marc D. Knox
20Patents
5h-index
32Co-inventors
69Inventor score
Filing activity: Aug 25, 1998 → Sep 12, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6504392B2 | Actively controlled heat sink for convective burn-in oven | Physics | 15 | Expired |
| US7259580B2 | Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test | Physics | 11 | Expired |
| US6122760A | Burn in technique for chips containing different types of IC circuitry | Physics | 11 | Expired |
| US7400162B2 | Integrated circuit testing methods using well bias modification | Physics | 10 | Expired |
| US6577146B2 | Method of burning in an integrated circuit chip package | Physics | 7 | Expired |
| US7759960B2 | Integrated circuit testing methods using well bias modification | Physics | 5 | Active |
| US7567090B2 | Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application | Physics | 5 | Active |
| US8854073B2 | Methods and apparatus for margin testing integrated circuits using asynchronously timed varied supply voltage and test patterns | Physics | 5 | Active |
| US10261108B2 | Low force wafer test probe with variable geometry | Physics | 3 | Active |
| US7564256B2 | Integrated circuit testing methods using well bias modification | Physics | 3 | Active |
| US7486098B2 | Integrated circuit testing method using well bias modification | Physics | 2 | Active |
| US11322473B2 | Interconnect and tuning thereof | Electricity | 1 | Active |
| US7265561B2 | Device burn in utilizing voltage control | Physics | 1 | Expired |
| US9269603B2 | Temporary liquid thermal interface material for surface tension adhesion and thermal control | Electricity | 1 | Active |
| US10663487B2 | Low force wafer test probe with variable geometry | Physics | 0 | Active |
| US7332927B2 | Apparatus for temporary thermal coupling of an electronic device to a heat sink during test | Physics | 0 | Active |
| US11029334B2 | Low force wafer test probe | Physics | 0 | Active |
| US10444260B2 | Low force wafer test probe | Physics | 0 | Active |
| US9437670B2 | Light activated test connections | Electricity | 0 | Active |
| US11561243B2 | Compliant organic substrate assembly for rigid probes | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.