Bonding pads for testing of a semiconductor device
US7259582B2 · kind B2 · utility
19Cited by
85References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 18, 2005 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Apr 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48139
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a first integrated circuit (IC) chip may comprise one or more bonding pads to which bonding wires from respective external leads may be connected. Other bonding wires connect the same bonding pads on the first IC chip to a second IC chip. This can be used, for example, to reduce the need for connections integral to the first IC chip for routing the signals received over the bonding wires internally in the first IC chip to the second IC chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.