Integrated circuit coolant microchannel assembly with targeted channel configuration
US7259965B2 · kind B2 · utility
24Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2005 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Dec 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.