Patent · US Expired

Vertical insulated gate transistor and manufacturing method

US7262460B2 · kind B2 · utility

2Cited by
4References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 8, 2003
Grant dateAug 28, 2007
Priority date
Expiry dateJul 15, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/516

Abstract

A vertical insulated gate transistor is manufactured by providing a trench (26) extending through a source layer (8) and a channel layer (6) towards a drain layer (2). A spacer etch is used to form gate portions (20) along the trench side walls, a dielectric material (30) is filled into the trench between the sidewalls gate portions (20), and a gate electrical connection layer (30) is formed at the top of the trench electrically connecting the gate portions (20) across the trench.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.