Vertical insulated gate transistor and manufacturing method
US7262460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2003 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Jul 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/516
Abstract
A vertical insulated gate transistor is manufactured by providing a trench (26) extending through a source layer (8) and a channel layer (6) towards a drain layer (2). A spacer etch is used to form gate portions (20) along the trench side walls, a dielectric material (30) is filled into the trench between the sidewalls gate portions (20), and a gate electrical connection layer (30) is formed at the top of the trench electrically connecting the gate portions (20) across the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.