Polishing pad with window
US7264536B2 · kind B2 · utility
17Cited by
29References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2003 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | May 31, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.