Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade
US7265034B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2005 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Jan 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of cutting an integrated circuit chip from a wafer having a plurality of integrated circuit chips is provided. An upper portion of the wafer is ablated using two laser beams to form two substantially parallel trenches that extend into the wafer from a top surface of the wafer through intermetal dielectric layers and at least partially into a substrate of the wafer. After the ablating to form the two trenches, cutting through the wafer between outer sidewalls of the two laser-ablated trenches with a saw blade is performed. A width between the outer sidewalls of the two laser-ablated trenches is greater than a cutting width of the saw blade. This may be particularly useful in lead-free packaging applications and/or applications where the intermetal dielectric layers use low-k dielectric materials, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.