Inventor · Taichung, TW

Ming-Chung Sung

13Patents

4h-index

23Co-inventors

56Inventor score

Filing activity: Jul 5, 2005 → Sep 21, 2015

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8823180B2	Package on package devices and methods of packaging semiconductor dies	Electricity	20	Active
US7265034B2	Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade	Electricity	19	Expired
US7951647B2	Performing die-to-wafer stacking by filling gaps between dies	Electricity	7	Active
US8652939B2	Method and apparatus for die assembly	Electricity	4	Active
US8796132B2	System and method for forming uniform rigid interconnect structures	Electricity	2	Active
US7642631B2	Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer	Electricity	2	Active
US9165876B2	Package-on-package structure and methods for forming the same	Electricity	1	Active
US8664039B2	Methods and apparatus for alignment in flip chip bonding	Electricity	1	Active
US9147584B2	Rotating curing	Electricity	1	Active
US8232183B2	Process and apparatus for wafer-level flip-chip assembly	Electricity	0	Active
US9985013B2	Package-on-package structure and methods for forming the same	Electricity	0	Active
US7977155B2	Wafer-level flip-chip assembly methods	Electricity	0	Active
US8927877B2	Looped interconnect structure	Emerging Cross-Sectional Technologies	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.