Semiconductor component having dummy segments with trapped corner air
US7265453B2 · kind B2 · utility
2Cited by
36References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2004 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Sep 24, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such that corners of the body segments do not include the trapped air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.